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Gate-level body biasing for subthreshold logic circuits: analytical modeling and design guidelines

机译:亚阈值逻辑电路的门级体偏置:分析建模和设计指南

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摘要

Gate-level body biasing provides an attractive solution to increase speed and robustness against process and temperature variations while maintaining energy efficiency. In this paper, the behavior of basic logic gates, designed according to the proposed design technique, is analytically examined with the main purpose of furnishing important guidelines to design efficient subthreshold digital circuits. Our modeling has been fully validated by comparing the predicted results with SPICE simulations performed for a commercial 45-nm complementary metal oxide semiconductor technology. Considering process, temperature and loading capacitance variations, the delay of an inverter is predicted with a maximum error lower than 16.5%. Even better results are obtained when our modeling is applied to more complex logic gates. Under process, loading capacitance and temperature variations, the delay of NAND2 and NOR2 logic gates is always predicted with an error below 10%. Good agreement between the predicted and simulated results makes our modeling a valuable support during the circuit design phase. Copyright (c) 2014 John Wiley & Sons, Ltd.
机译:门级体偏置提供了一种有吸引力的解决方案,可提高速度和鲁棒性以应对工艺和温度变化,同时保持能效。本文以提出的设计技术为基础,对基本逻辑门的行为进行了分析,其主要目的是为设计有效的亚阈值数字电路提供重要指导。通过将预测结果与针对商用45纳米互补金属氧化物半导体技术执行的SPICE仿真进行比较,我们的建模已得到充分验证。考虑到工艺,温度和负载电容的变化,预测逆变器的延迟,其最大误差低于16.5%。当我们的建模应用于更复杂的逻辑门时,可以获得更好的结果。在处理,负载电容和温度变化的情况下,总是预测NAND2和NOR2逻辑门的延迟,其误差低于10%。预测结果与仿真结果之间的良好一致性使我们的建模成为电路设计阶段的宝贵支持。版权所有(c)2014 John Wiley&Sons,Ltd.

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