机译:使用器件仿真分析电极厚度变化对聚合物薄膜晶体管性能参数的影响
Department of Polymer and Processing Engineering, Indian Institute of Technology (IIT) Roorkee, Saharanpur Campus, Roorkee-247667, Uttarakhand, India;
Department of Electronics and Computer Engineering, Indian Institute of Technology, Roorkee-247667, India;
Department of Polymer and Processing Engineering, Indian Institute of Technology (IIT) Roorkee, Saharanpur Campus, Roorkee-247667, Uttarakhand, India;
bottom gate bottom contact; BGBC; bottom gate top contact; BGTC; top gate bottom contact; TGBC; top gate top contact structure; electrode thickness variation; 2D device simulation; mobility; polymer thin film transistor; PTFT; advanced intelligence flexible displays; electrical performance parameters;
机译:逆变器电路性能分析:通过电路仿真改变聚合物薄膜晶体管中有源层的厚度
机译:基于半导体和介电层厚度变化的有机薄膜晶体管电参数分析
机译:通过二维仿真了解半导体厚度对有机薄膜晶体管器件特性的影响
机译:顶级和底部栅极聚合物薄膜晶体管通过二维数值装置仿真分析
机译:新型半导体器件和集成电路(砷化镓MESFET,IC模拟,MODFET,薄膜晶体管,非晶硅)的分析和设计。
机译:基于具有纳米厚度的薄膜晶体管的灵活透明的人工突触装置勘误
机译:ZnO薄膜晶体管光泄漏电流的机理模拟