CORPORATES

摘要

Chipmaker BROADCOM encountered a welcome reception from investors for its debut investment-grade bond last week -the biggest deal to come to the US market market since November last year. The US$13.55bn four-part trade was bigger than the US$12bn initially expected by the market, as investors piled into the deal. The book topped US$30bn at its peak but dipped back to US$27.9bn as pricing was pulled in.