...
机译:像TEM一样的发射几何形状和简化的去嵌入功能,可精确地通过硅进行通孔表征
Department of Industrial and Information Engineering, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy;
Department of Industrial and Information Engineering, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy;
MST EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA;
MST EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA;
MST EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA;
Cisco Corporation, San Jose, CA, USA;
MST EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA;
MST EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA;
Department of Industrial and Information Engineering, UAq EMC Laboratory, University of L’Aquila, L’Aquila, Italy;
Through-silicon vias; Geometry; Silicon; Semiconductor device measurement; Solid modeling; Integrated circuit modeling; Ports (Computers);
机译:精确的RF设备和ICS去嵌入应用的硅上虚拟开放设备的分析和宽带建模(DC至50 GHz)
机译:两种多端口去嵌入方法可准确地表征60 GHz差分放大器的晶片
机译:用于深亚微米晶体管的RF /毫米波噪声表征和建模的精确两端口去嵌入技术
机译:简化的解除嵌入技术:匹配和几何假设的一些效果
机译:零磁通电磁悬浮系统中的精确简化交互模型对多自由度滑模控制器性能的影响。
机译:陆空导弹发射车快速准确的定位定向方法研究
机译:去嵌入传输线测量,以精确设计IC设计
机译:有机硅灌封化合物的表征。 I.偏心旋转盘几何中使用计量机械光谱仪测定两种交联硅橡胶的动态力学性能