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Wet chemical etching of PbTe and Pb1-x Sn (x) Te crystal surfaces with bromine-releasing aqueous H2O2-HBr-citric acid solutions

机译:用释放溴的H2O2-HBr-柠檬酸水溶液对PbTe和Pb1-x Sn(x)Te晶体表面进行湿化学蚀刻

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摘要

We have studied the dynamic chemical polishing of single crystals of PbTe and Pb1-x Sn (x) Te solid solutions in H2O2-HBr-citric acid bromine-releasing etchants under reproducible hydrodynamic conditions and constructed projections of constant etch rate surfaces using simplex design of experiments. The dissolution of the crystals in the polishing mixtures has been shown to be diffusion-limited. The polished surfaces have been characterized by microstructural analysis, scanning electron microscopy, and atomic force microscopy. We have determined the compositions of H2O2-HBr-citric acid polishing etchants that can be used for high-quality polishing of the surface of the PbTe and Pb1-x Sn (x) Te semiconductor materials at dissolution rates in the range 3.0-18.0 mu m/min.
机译:我们研究了在可重现的流体动力学条件下在H2O2-HBr-柠檬酸溴释放蚀刻剂中对PbTe和Pb1-x Sn(x)Te固溶体进行单晶的动态化学抛光,并使用单晶设计设计了恒定蚀刻速率表面的投影。实验。晶体在抛光混合物中的溶解已显示出受扩散限制。抛光的表面已通过微观结构分析,扫描电子显微镜和原子力显微镜进行了表征。我们已经确定了H2O2-HBr-柠檬酸抛光蚀刻剂的成分,该成分可用于以3.0-18.0μm的溶解速率高质量抛光PbTe和Pb1-x Sn(x)Te半导体材料的表面米/分

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