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首页> 外文期刊>IEEE Transactions on Industrial Electronics >Unified SPICE Compatible Model for Large and Small-Signal Envelope Simulation of Linear Circuits Excited by Modulated Signals
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Unified SPICE Compatible Model for Large and Small-Signal Envelope Simulation of Linear Circuits Excited by Modulated Signals

机译:调制信号激发线性电路的大信号和小信号包络仿真的统一SPICE兼容模型

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摘要

The envelope-simulation method, developed earlier for large-signal simulation [time domain (TRAN)] is extended to include small-signal envelope simulation (ac) and dc sweep simulation (steady state for a range of carrier frequencies). The model is derived for amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM) modulation schemes and is demonstrated on a piezoelectric transformer circuit. The model is based on the equivalent circuit approach and can be run on any modern electronic circuit simulator. An excellent agreement was found between the simulation results according to the new unified envelope model, full simulation, and experimental results.
机译:先前为大信号仿真[时域(TRAN)]开发的包络仿真方法已扩展为包括小信号包络仿真(ac)和dc扫描仿真(对于一系列载波频率为稳态)。该模型是针对振幅调制(AM),频率调制(FM)和相位调制(PM)调制方案而得出的,并在压电变压器电路上进行了演示。该模型基于等效电路方法,可以在任何现代电子电路模拟器上运行。在根据新的统一包络模型进行的仿真结果,完全仿真和实验结果之间找到了极好的一致性。

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