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Analysis on the Grounding Architecture of a Technology Demonstrator Vehicle

机译:技术示范车辆接地架构分析

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摘要

In launch vehicles, Inter system and intra system interfaces exist among various onboard avionic modules. In addition to that, the on-board systems are interfaced to ground checkout system also which is yet another complex system. Isolation of grounds is an important concept in launch vehicle avionics system integration and design. Understanding ground loops and chassis potential is essential for achieving accuracy in measurements and prevention of failure propagation. This paper is a study of the grounding architecture of a Technology Demonstrator Vehicle (TDV). For this purpose, simulation models of on-board and checkout systems have been generated in ORCAD PSPICE. An attempt is made to understand the causes of chassis potential and ground loops. Monitoring networks are analyzed to determine its robustness against ground potential lift. The paper also discusses the grounding-related issues faced during the testing TDV and the methods adopted to overcome them.
机译:在发射车辆中,各种板载航空模块中存在系统间和系统内部接口。除此之外,在板上系统还接通到地面结账系统,也是另一个复杂系统。地面的孤立是发射车航空电子系统集成和设计的重要概念。了解地面环和底盘电位对于实现测量和预防失败传播的准确性至关重要。本文是对技术示范器车辆(TDV)的接地架构的研究。为此目的,在Orcad Pspice中生成了板载和结帐系统的仿真模型。尝试了解底盘潜力和地面环的原因。分析监测网络以确定其防止地面潜在电梯的鲁棒性。本文还讨论了测试TDV期间面临的接地相关问题,并采取的方法克服它们。

著录项

  • 来源
    《IETE Journal of Research》 |2020年第4期|454-459|共6页
  • 作者单位

    Vikram Sarabhai Space Ctr Syst Engn & Vehicle Integrat Grp Thiruvananthapuram Kerala India;

    Vikram Sarabhai Space Ctr Syst Engn & Vehicle Integrat Grp Thiruvananthapuram Kerala India;

    Vikram Sarabhai Space Ctr Syst Engn & Vehicle Integrat Grp Thiruvananthapuram Kerala India;

    Vikram Sarabhai Space Ctr Syst Engn & Vehicle Integrat Grp Thiruvananthapuram Kerala India;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Electromagnetic compatibility; Grounding;

    机译:电磁兼容性;接地;

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