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Hierarchical Multi-Chip Architecture for High Capacity Scalability of Fully Parallel Hamming-Distance Associative Memories

机译:完全并行汉明距离关联存储器的高容量可扩展性的分层多芯片体系结构

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摘要

In this paper, we present a hierarchical multi-chip architecture which employs fully digital and word-parallel associative memories based on Hamming distance. High capacity scalability is critically important for associative memories since the required database capacity depends on the various applications. A multi-chip structure is most efficient for the capacity scalability as well as the standard memories, however, it is difficult for the conventional nearest-match associative memories. The present digital implementation is capable of detecting all the template data in order of the exact Hamming distance. Therefore, a hierarchical multi-chip structure is simply realized by using extra register buffers and an interchip pipelined priority decision - circuit hierarchically embedded in multiple chips. It achieves fully chip- and word-parallel Hamming distance search with no throughput decrease, additional clock latency of O(log P), and inter-chip wires of O(P) in a P-chip structure. The feasibility of the architecture and circuit implementation has been demonstrated by post-layout simulations. The performance has been also estimated based on measurement results of a single-chip implementation.
机译:在本文中,我们提出了一种分层多芯片架构,该架构采用基于汉明距离的全数字和字并行关联存储器。高容量可伸缩性对于关联存储器至关重要,因为所需的数据库容量取决于各种应用程序。对于容量可伸缩性以及标准存储器,多芯片结构是最有效的,但是,对于常规的最近匹配关联存储器来说,这是困难的。本数字实现能够以精确的汉明距离的顺序检测所有模板数据。因此,通过使用额外的寄存器缓冲器和芯片间流水线优先级决策-分层地嵌入多个芯片的电路,可以简单地实现分层的多芯片结构。它实现了完全芯片和字并行的汉明距离搜索,而不会降低吞吐量,不会增加O(log P)的时钟延迟,并且不会在P芯片结构中产生O(P)的芯片间连线。布局后仿真已证明了架构和电路实现的可行性。还基于单芯片实现的测量结果来评估性能。

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