High-Speed Logic Circuitry Using Bootstrapped and Low-Temperature Polysilicon (LTPS) Technologies for TFT-LCD Panels

摘要

In this paper, a high-speed logic circuitry using bootstrapped and low-temperature polysilicon (LTPS) technologies for TFT-LCD panels is proposed. The new circuitry realizes high-speed operation owing to the application of a logic-swing voltage that is wider than the power-supply voltage using bootstrapped technology. As a result, the new logic circuitry can be operated at an operational frequency around 3-10 times higher than that of the conventional circuitry under the conditions of a 0.5 pF load capacitor at the output of a noninverting buffer and + 10V power-supply voltages. The new circuit is named "BST-TFT logic circuitry."