首页> 外文期刊>IEICE Transactions on Electronics >Fabrication and Characterization of Ferroelectric Poly(Vinylidene Fluoride-Trifluoroethylene) (P(VDF-TrFE)) Thin Film on Flexible Substrate by Detach-and-Transferring
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Fabrication and Characterization of Ferroelectric Poly(Vinylidene Fluoride-Trifluoroethylene) (P(VDF-TrFE)) Thin Film on Flexible Substrate by Detach-and-Transferring

机译:分离与转移在柔性基板上铁电聚偏氟乙烯-三氟乙烯(P(VDF-TrFE))薄膜的制备与表征

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摘要

In this paper, a 60nm-thick ferroelectric film of poly(vinylidene fluoride-trifluoroethylene) on a flexible substrate of aluminum foil was fabricated and characterized. Compared to pristine silicon wafer, Al-foil has very large root-mean-square (RMS) roughness, thus presenting challenges for the fabrication of flat and uniform electronic devices on such a rough substrate. In particular, RMS roughness affects the leakage current of dielectrics, the uniformity of devices, and the switching time in ferroelectrics. To avoid these kinds of problems, a new thin film fabrication method adopting a detach-and-transfer technique has been developed. Here, 'detach' means that the ferroelectric film is detached from a flat substrate (sacrificial substrate), and 'transfer' refers to the process of the detached film being moved onto the rough substrate (main substrate). To characterize the dielectric property of the transferred film, polarization and voltage relationships were measured, and the results showed that a hysteresis loop could be obtained with low leakage current.
机译:本文在铝箔柔性基板上制备并表征了厚度为60nm的聚偏二氟乙烯-三氟乙烯的铁电薄膜。与原始硅晶圆相比,铝箔具有非常大的均方根(RMS)粗糙度,因此在这种粗糙的基板上制造平坦且均匀的电子设备面临挑战。尤其是,RMS粗糙度会影响电介质的泄漏电流,器件的均匀性以及铁电体的切换时间。为了避免这些问题,已经开发了采用分离和转移技术的新的薄膜制造方法。在此,“剥离”是指将铁电膜从平坦的基板(牺牲性基板)上剥离,“转移”是指将剥离的膜移动到粗糙的基板(主基板)上的过程。为了表征转移膜的介电性能,测量了极化和电压关系,结果表明可以在低泄漏电流下获得磁滞回线。

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