机译:圆锥形柔性凸台进行液相微连接的仿真与实验
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University 744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan;
On leave from Fukuoka Industry, Science & Technology Foundation (Fukuoka IST);
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University 744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan;
compliant bump; solder electrodes; liquid phase bonding; simulation; interconnection;
机译:圆锥形柔性凸台进行液相微连接的仿真与实验
机译:圆锥形柔性凸台进行液相微连接的仿真与实验
机译:圆锥形柔性凸台进行液相微连接的仿真与实验
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