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Effect of Passivation on Drain Current Dispersion for A1GaN/GaN HEMTs

机译:钝化对AlGaN / GaN HEMT漏极电流色散的影响

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A1GaN/GaN HEMTs with different passivation layers were studied using pulsed Ⅰ-V system. The maximum drain current showed higher values at pulsed conditions as compared with DC for SiN passivation, and vice versa for Al_2O_3, SiO_2 and without passivation. The drain current decreased with increasing the on-state time for SiN, which indicated that the most probable location of trap was at the A1GaN layer beneath the gate Increasing tendency of drain current with increasing on-state time indicated that the surface traps were dominant for this behavior, which was the case for Al_2O_3, SiO_2, and without passivation.
机译:采用脉冲Ⅰ-V系统研究了不同钝化层的AlGaN / GaN HEMT。与DC相比,SiN钝化时的最大漏极电流在脉冲条件下具有更高的值,而对于Al_2O_3,SiO_2和无钝化而言,最大漏极电流则相反。随SiN导通时间的增加,漏极电流减小,这表明陷阱的最可能位置在栅极下方的AlGaN层上。随着导通时间的增加,漏极电流的增加趋势表明表面陷阱是硅的主要组成部分。这种行为是Al_2O_3,SiO_2且没有钝化的情况。

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