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Wafer thermal desorption spectrometry in a rapid thermal processorusing atmospheric pressure ionization mass spectrometry

机译:快速热处理器中的晶片热解吸光谱法,使用大气压电离质谱法

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摘要

This paper demonstrates the possibility of performing thermalndesorption spectrometry (TDS) on wafers in an atmospheric pressure rapidnthermal processor (RTP). A special gas sampling system is described,nwhich allows the analysis of gas composition inside the RTP chamber withnatmospheric pressure ionization mass spectrometry (APIMS). Sampling isncontrolled with no valve operation and high dilution of the sample gasnflow can be achieved while maintaining a short sample transfer time. Itnis shown how gas flows can be optimized to improve the sensitivity andnresolution of TDS spectra. The RTP-APIMS setup was used in a study of Hn2O absorption by low dielectric constant fluorinated silicanglass (FSG) films, helping to develop a cap that reduced H2Onabsorption upon storage by a factor of 60. NH3 is shown tondesorb from FSG and SiO2 films deposited by plasma-enhancednchemical vapor deposition (PECVD), which may be of concern for thenreliability of integrated circuits
机译:本文证明了在大气压快速热处理器(RTP)中对晶片进行热脱附光谱(TDS)的可能性。描述了一种特殊的气体采样系统,该系统允许使用大气压电离质谱(APIMS)分析RTP腔室内的气体成分。无需阀门操作即可控制采样,在保持较短的样品传输时间的同时,可以实现样品气流的高稀释。 Itnis展示了如何优化气流以提高TDS光谱的灵敏度和分辨率。 RTP-APIMS装置用于研究低介电常数氟化硅玻璃(FSG)膜对Hn2O的吸收,从而有助于开发出一种能够在储存时将H2的吸收降低60倍的封盖。通过等离子体增强化学气相沉积(PECVD),这可能与集成电路的可靠性有关

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