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Performance evaluation of high-power GaAs Schottky and siliconp-i-n rectifiers in hard- and soft-switching applications

机译:硬开关和软开关应用中大功率GaAs肖特基和Siliconp-i-n整流器的性能评估

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摘要

The dynamic switching characteristics of high-power GaAs Schottkynand silicon p-i-n rectifiers are studied at various temperatures.nDevices were first characterized to measure forward and reverse I-V,nC-V, reverse breakdown voltage, and reverse-recovery performance. Thensame devices were characterized for turn on and turn off in switchingncircuits designed to study the dynamic switching performances undernhard- and soft-switching conditions at different temperatures. Advancedntwo-dimensional (2-D) mixed device and circuit simulations were used tonstudy the internal plasma dynamics under boundary conditions imposed bynthe circuit operation. It is shown that for hard-switching applications,nGaAs Schottky power rectifiers exhibit significantly reduced switchingnpower losses compared to silicon p-i-n rectifiers. For soft-switchingnapplications, there is not a significant difference in the switchingnpower losses for these two devices. Diode performance at elevatedntemperatures is measured and simulated, and temperature dependencies ofnswitching and conduction power losses are analyzed
机译:研究了大功率GaAs肖特基二极管和硅p-i-n整流器在不同温度下的动态开关特性。n首先对器件进行了表征,以测量正向和反向I-V,nC-V,反向击穿电压和反向恢复性能。然后针对开关电路中的开关特性进行了表征,旨在研究硬开关和软开关条件在不同温度下的动态开关性能。使用先进的二维(2-D)混合器件和电路仿真研究了在电路操作施加的边界条件下的内部等离子体动力学。结果表明,对于硬开关应用,与硅p-i-n整流器相比,nGaAs肖特基功率整流器的开关n功率损耗大大降低。对于软开关应用,这两种设备的开关功率损耗没有显着差异。测量并模拟了高温下的二极管性能,并分析了开关和传导功率损耗的温度依赖性

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