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Performance evaluation of high-power GaAs Schottky and silicon p-i-n rectifiers in hard- and soft-switching applications

机译:硬开关和软开关应用中大功率GaAs肖特基和硅p-i-n整流器的性能评估

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The dynamic switching characteristics of 200 V high-power GaAs Schottky and silicon P-I-N rectifiers are studied at various temperatures under both hard- and soft-switching conditions. Devices were first characterized to measure forward and reverse I-V, C-V, reverse breakdown voltage and reverse recovery performances. The same devices were characterized for turn-on and turn-off in switching circuits designed to study the dynamic switching performances under hard- and soft-switching conditions at different temperatures. Advanced finite element based mixed device and circuit simulations were used to study the internal plasma dynamics under boundary conditions imposed by circuit operation. It is shown that, for hard-switching applications, GaAs Schottky power rectifiers exhibit significantly reduced switching power losses compared to silicon P-I-N rectifiers. For soft-switching applications, there is no significant difference in the switching power losses for these two devices. Diode performance at elevated temperatures is studied and the temperature dependencies of switching and conduction power are analyzed.
机译:在硬开关和软开关条件下的各种温度下,研究了200 V大功率GaAs肖特基和P-I-N硅整流器的动态开关特性。器件首先被表征为测量正向和反向I-V,C-V,反向击穿电压和反向恢复性能。相同的器件在开关电路中具有导通和关断特性,旨在研究硬开关和软开关条件下不同温度下的动态开关性能。基于高级有限元的混合器件和电路仿真被用于研究在电路操作施加的边界条件下的内部等离子体动力学。结果表明,对于硬开关应用,与硅P-I-N整流器相比,GaAs肖特基功率整流器的开关功率损耗显着降低。对于软开关应用,这两种设备的开关功率损耗没有显着差异。研究了高温下的二极管性能,并分析了开关和传导功率的温度依赖性。

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