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Performance evaluation of high-power GaAs Schottky and silicon p-i-n rectifiers in hard- and soft-switching applications

机译:高功率GaAs肖特基和硅P-I-N整流器的性能评估在硬开和软切换应用中的整流器

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The dynamic switching characteristics of 200 V high-power GaAs Schottky and silicon P-I-N rectifiers are studied at various temperatures under both hard- and soft-switching conditions. Devices were first characterized to measure forward and reverse I-V, C-V, reverse breakdown voltage and reverse recovery performances. The same devices were characterized for turn-on and turn-off in switching circuits designed to study the dynamic switching performances under hard- and soft-switching conditions at different temperatures. Advanced finite element based mixed device and circuit simulations were used to study the internal plasma dynamics under boundary conditions imposed by circuit operation. It is shown that, for hard-switching applications, GaAs Schottky power rectifiers exhibit significantly reduced switching power losses compared to silicon P-I-N rectifiers. For soft-switching applications, there is no significant difference in the switching power losses for these two devices. Diode performance at elevated temperatures is studied and the temperature dependencies of switching and conduction power are analyzed.
机译:在硬质和软切换条件下,在各种温度下研究了200V高功率GaAs肖特基和硅P-IN整流器的动态开关特性。首先表征设备以测量前向和反向I-V,C-V,反向击穿电压和反向恢复性能。相同的设备的特征在于开关电路中的开启和关断,旨在在不同温度下的硬质和软切换条件下研究动态切换性能。基于先进的有限元的混合装置和电路模拟用于研究电路操作施加的边界条件下的内部等离子体动力学。结果表明,对于硬开关应用,与硅P-I-N整流器相比,GaAs肖特基电力整流器表现出显着降低的开关功率损耗。对于软切换应用,这两个设备的开关功率损耗没有显着差异。研究了高温下的二极管性能,分析了开关和导通功率的温度依赖性。

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