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Circuit-Based Electrothermal Simulation of Power Devices by an Ultrafast Nonlinear MOR Approach

机译:超快速非线性MOR方法的功率器件基于电路的电热仿真

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摘要

This paper presents an efficient circuit-based approach for the nonlinear dynamic electrothermal simulation of power devices and systems subject to radical self-heating. The strategy relies on the synthesis of a nonlinear compact thermal network extracted from a finite-element model by a novel model-order reduction method requiring a computational time orders of magnitude lower than conventional techniques. Unlike commonly employed approaches, the proposed network allows reconstructing the whole time evolution of the temperature field in all the points of the domain with high accuracy. Electrothermal simulations are enabled in a commercial SPICE-like simulator by coupling such a network with subcircuits that describe the electrical device behavior by accounting for the temperature dependence of the key physical parameters. As a case study, the dynamic electrothermal analysis of a packaged silicon carbide power MOSFET undergoing a short-circuit test is performed, showcasing the performance of the approach and highlighting the need of including the thermal nonlinearities to achieve reliable results.
机译:本文提出了一种有效的基于电路的方法,用于受自激热影响的功率器件和系统的非线性动态电热仿真。该策略依赖于通过一种新颖的模型级约简方法从有限元模型中提取的非线性紧凑热网络的合成,该方法所需的计算时间量级要低于传统技术。与通常采用的方法不同,所提出的网络允许在域的所有点上以高精度重建温度场的整个时间演变。通过将此类网络与子电路耦合在一起,可以在商业类SPICE模拟器中启用电热仿真,该子电路通过考虑关键物理参数的温度依赖性来描述电气设备的行为。作为案例研究,对经过短路测试的碳化硅功率MOSFET封装进行了动态电热分析,展示了该方法的性能并强调需要包括热非线性以实现可靠的结果。

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