首页> 外文期刊>IEEE Transactions on Power Electronics >Wideband Modeling of Integrated Power Passive Structures: The Series Resonator
【24h】

Wideband Modeling of Integrated Power Passive Structures: The Series Resonator

机译:集成功率无源结构的宽带建模:串联谐振器

获取原文
获取原文并翻译 | 示例
           

摘要

This paper presents a higher order frequency plane model for integrated series resonant module (ISRM). The cause for the occurring of the high frequency impedance peak is identified as the parallel resonance between the winding inductance and its inter-winding capacitance. The inter-winding capacitance can be calculated from a transmission-line-based lumped model using Schwartz-Christoffel transformation. The simulation results using the proposed model correlate the small-signal test results very well. The proposed higher order impedance model will help to evaluate the high frequency behavior of an ISRM or to minimize the high frequency parasitics. It can also be easily implemented in the design-oriented algorithm to facilitate the design and optimization of an ISRM. More simulation and experimental results will be included in the final paper. The application of this model to more complicated structures as well as some practical design issues will also be discussed.
机译:本文提出了一种用于集成串联谐振模块(ISRM)的高阶频率平面模型。高频阻抗峰值出现的原因被确定为绕组电感与其绕组间电容之间的并联谐振。绕组间电容可以使用Schwartz-Christoffel变换从基于传输线的集总模型中计算出来。使用所提出的模型的仿真结果与小信号测试结果非常相关。拟议的高阶阻抗模型将有助于评估ISRM的高频特性或使高频寄生效应最小化。它也可以在面向设计的算法中轻松实现,以简化ISRM的设计和优化。更多的模拟和实验结果将包含在最终论文中。还将讨论该模型在更复杂的结构中的应用以及一些实际的设计问题。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号