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Transient thermal response of power semiconductors to short power pulses

机译:功率半导体对短功率脉冲的瞬态热响应

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Thermal response curves used to calculate the peak junction temperature of power semiconductors are normally derived by experimental identification of the parameters of a known model. Unfortunately the model, developed many years ago, is inappropriate for large surges of short time duration, as they are encountered in present day power conditioning systems. An alternative model is derived, the limits of its accuracy are estimated, and a correction factor is described. A verification of the accuracy of the two methods is also presented. For pulse widths shorter than the thermal transit time, which is in the order of 300 mu s, the peak junction temperature can be more accurately calculated with an expression derived in the present work, which takes into consideration the active volume in which the heat is generated, than with the transient thermal response curve. A correction factor, a function of the width of the pulse, inserted in this equation, further improves its accuracy.
机译:通常通过实验确定已知模型的参数来得出用于计算功率半导体的峰值结温的热响应曲线。不幸的是,很多年前开发的模型不适用于短时间的大浪涌,因为它们在当今的功率调节系统中会遇到。得出一个替代模型,估计其精度极限,并描述一个校正因子。还介绍了这两种方法的准确性。对于比热传递时间短的脉冲宽度(约为300μs),可以使用本研究得出的表达式更精确地计算出峰值结温,该表达式考虑了热量在其中的有效体积。与瞬态热响应曲线相比。插入该方程式的校正因子是脉冲宽度的函数,可以进一步提高其精度。

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