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Survey of noise performances and scaling effects in deep submicrometer CMOS devices from different foundries

机译:来自不同代工厂的深亚微米CMOS器件的噪声性能和缩放效应的调查

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摘要

Submicrometer CMOS technologies provide well-established solutions to the implementation of low-noise front-end electronics for a wide range of detector applications. Since commercial CMOS processes maintain a steady trend in device scaling, it is essential to monitor the impact of these technological advances on the noise parameters of the devices. In this paper we present the results of an extensive analysis carried out on CMOS transistors fabricated in 0.35, 0.25, and 0.18 /spl mu/m technologies from different foundries. This allows us to evaluate the behavior of 1/f and channel thermal noise parameters with different gate oxide thickness and minimum channel length and to give an estimate of their process-to-process spread. The experimental analysis is focused on actual device operating conditions in monolithic detector readout systems. This means that moderate or weak inversion are often the only relevant regions for front-end devices. To account for different detector requirements, the noise behavior of devices with different geometries and input capacitance was investigated. The large set of data gathered from the measurements provides a powerful tool to model noise parameters and establish front-end design criteria in deep submicrometer CMOS processes.
机译:亚微米CMOS技术为各种检测器应用提供了完善的解决方案,以实现低噪声前端电子设备。由于商用CMOS工艺在器件缩放方面保持稳定趋势,因此必须监视这些技术进步对器件噪声参数的影响。在本文中,我们介绍了对以不同铸造厂的0.35、0.25和0.18 / spl mu / m技术制造的CMOS晶体管进行的广泛分析的结果。这使我们能够评估具有不同栅氧化层厚度和最小沟道长度的1 / f和沟道热噪声参数的行为,并估计其工艺间距。实验分析着重于整体检测器读数系统中的实际设备工作条件。这意味着中等或较弱的反转通常是前端设备的唯一相关区域。为了满足不同的检测器要求,研究了具有不同几何形状和输入电容的设备的噪声行为。从测量中收集的大量数据为在深亚微米CMOS工艺中建模噪声参数并建立前端设计标准提供了强大的工具。

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