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首页> 外文期刊>IEEE Transactions on Nuclear Science >Multiple-Bit Upset in 130 nm CMOS Technology
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Multiple-Bit Upset in 130 nm CMOS Technology

机译:130 nm CMOS技术的多位翻转

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The probability of proton-induced multiple-bit upset (MBU) has increased in highly-scaled technologies because device dimensions are small relative to particle event track size. Both proton-induced single event upset (SEU) and MBU responses have been shown to vary with angle and energy for certain technologies. This work analyzes SEU and MBU in a 130 nm CMOS SRAM in which the single-event response shows a strong dependence on the angle of proton incidence. Current proton testing methods do not account for device orientation relative to the proton beam and, subsequently, error rate prediction assumes no angular dependencies. Proton-induced MBU is expected to increase as integrated circuits continue to scale into the deep sub-micron regime. Consequently, the application of current testing methods will lead to an incorrect prediction of error rates
机译:由于器件尺寸相对于粒子事件轨迹尺寸较小,因此在大规模技术中,质子诱导的多位翻转(MBU)的可能性有所增加。对于某些技术,已证明质子诱导的单事件翻转(SEU)和MBU响应都随角度和能量而变化。这项工作分析了130 nm CMOS SRAM中的SEU和MBU,其中单事件响应显示出对质子入射角的强烈依赖性。当前的质子测试方法没有考虑相对于质子束的装置取向,并且随后,错误率预测假定没有角度依赖性。随着集成电路继续扩展到深亚微米范围,质子诱导的MBU有望增加。因此,当前测试方法的应用将导致错误率的错误预测

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