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Analyzing the Effectiveness of a Frame-Level Redundancy Scrubbing Technique for SRAM-based FPGAs

机译:分析基于SRAM的帧级冗余清理技术的有效性

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Radiation effects such as soft errors are the major threat to the reliability of SRAM-based FPGAs. This work analyzes the effectiveness in correcting soft errors of a novel scrubbing technique using internal frame redundancy called Frame-level Redundancy Scrubbing (FLR-scrubbing). This correction technique can be implemented in a coarse grain TMR design. The FLR-scrubbing technique was implemented on a mid-size Xilinx Virtex-5 FPGA device used as a case study. The FLR-scrubbing technique was tested under neutron radiation and fault injection. Implementation results demonstrated minimum area and energy consumption overhead when compared to other techniques. The time to repair the fault is also improved by using the Internal Configuration Access Port (ICAP). Neutron radiation test results demonstrated that the proposed technique is suitable for correcting accumulated SEUs and MBUs.
机译:软错误等辐射效应是对基于SRAM的FPGA可靠性的主要威胁。这项工作分析了使用内部帧冗余(称为帧级冗余擦洗(FLR-scrubbing))纠正新型擦洗技术的软错误的有效性。可以在粗粒TMR设计中实施此校正技术。 FLR净化技术在中型Xilinx Virtex-5 FPGA器件上进行了案例研究。 FLR洗涤技术在中子辐射和断层注入下进行了测试。与其他技术相比,实施结果证明了最小的面积和能耗开销。通过使用内部配置访问端口(ICAP),也可以缩短修复故障的时间。中子辐射测试结果表明,该技术适用于校正累积的SEU和MBU。

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