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首页> 外文期刊>IEEE transactions on nanotechnology >High-Performance High-$K$/Metal Planar Self-Aligned Gate-All-Around CMOS Devices
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High-Performance High-$K$/Metal Planar Self-Aligned Gate-All-Around CMOS Devices

机译:高性能High- $ K $ /金属平面自对准全栅CMOS器件

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By introducing high-K dielectrics and metal gate in our planar self-aligned gate-all-around (GAA) fabrication process, we have successfully fabricated sub-35 nm CMOS devices that exhibit high-performance drive currents (2230/1000 muA/ mum for N/ P at Vd = 1.2 V), low off-state currents (3/5 nA/mum), and excellent subthreshold characteristics. When benchmarked with other published multigate data, the results presented in this paper are proved to be among the best and underline the potential of planar self-aligned GAA devices for the 32 nm technology and below. In particular, it is demonstrated that an optimized supply voltage can bring a significant improvement in circuit time delay and power when using GAA devices.
机译:通过在我们的平面自对准全栅(GAA)制造工艺中引入高 K 电介质和金属栅极,我们已经成功地制造了具有高性能驱动电流的低于35 nm CMOS器件(对于 N / P 在 Vd = 1.2 V时为2230/1000 muA / mum),低断态电流(3/5 nA /妈妈)和出色的亚阈值特征。当与其他已公开的多栅极数据进行基准比较时,该论文提出的结果被证明是最好的,并突显了平面自对准GAA器件在32 nm及以下工艺中的潜力。特别是,证明了使用GAA器件时,优化的电源电压可以显着改善电路时间延迟和功耗。

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