A non-contact interconnection through an electrically thick ground plate common to two microstrip lines

摘要

Coupling between two microstrip lines through a rectangular slot in a common, electrically thick ground plate is analyzed. The results are applied to examine the properties of a vertical, noncontact line-to-line transition. An efficient and accurate design model is constructed. The model allows insight into the coupling characteristics of the device with minimal computational effort. Measured results are used to verify the efficacy of the solution. Analytical or highly convergent forms of the model parameters are derived whenever possible.