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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function
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Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function

机译:使用闭合形式的格林函数计算多层板上通孔的等效电容

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A method based on the quasi-static approximation for computing the equivalent capacitance of a via is presented in this paper. The geometry of a via consists of traces, pads and a perfectly conducting cylindrical rod; the via is buried in a multilayered dielectric medium with optional reference (ground) planes. The total number of traces, pads, and ground planes can be arbitrary, as well as the angles and cross sections. The method is based on the excess charge formulation of an integral equation applied in conjunction with the recently developed closed-form Green's function.
机译:提出了一种基于准静态近似的通孔等效电容计算方法。通孔的几何形状由走线,焊盘和导电性良好的圆柱形杆组成。过孔埋在具有可选参考(接地)平面的多层介电介质中。迹线,焊盘和地平面的总数以及角度和横截面可以是任意的。该方法基于结合最近开发的闭式格林函数应用的积分方程的过量电荷公式。

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