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首页> 外文期刊>IEEE Transactions on Microwave Theory and Techniques >Stochastic EMI Noise Model of PCB Layout for Circuit-Level Analysis of System in IoT Applications
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Stochastic EMI Noise Model of PCB Layout for Circuit-Level Analysis of System in IoT Applications

机译:IOT应用中系统电路级分析的PCB布局随机EMI噪声模型

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摘要

In this article, a simple noise model is proposed for analysis of electromagnetic interference (EMI) on printed circuit board (PCB) layout of an electronic device. In Internet of Things (IoT) applications, devices are connected wirelessly and this results in electromagnetic pollution in environment. This may degrade the performance and/or even stop the operation of present devices in the shared setting. Internal and external interferences, due to near- and far-field are modeled as two independent random voltage sources. These sources can be treated as noise source like the thermal noise one in circuit noise analysis including the physical layout and electromagnetic threat. As a quantitative measure of electromagnetic pollution, EMI environment temperature is defined based on aggregation of waves emitted from different wireless device antennas. Also, for the PCBs, a stochastic EMI radiation resistance is defined based on system components' placement and layout. This resistance can be used as an effective measure of interference potential severity for system PCB in an environment. The model is verified by specific designed and fabricated mixed-signal test board. The comparison between analytic model and measurement results shows a moderate accuracy which is acceptable in most predictive electromagnetic compatibility (EMC)/EMI verification. The proposed model is valid up to some GHz for conventional PCB physical parameters.
机译:在本文中,提出了一种简单的噪声模型,用于分析电子设备的印刷电路板(PCB)布局上的电磁干扰(EMI)。在物联网(物联网)应用中,设备无线连接,这导致环境中的电磁污染。这可能会降低性能和/甚至停止共享设置中当前设备的操作。由于附近和远场的内部和外部干扰被建模为两个独立的随机电压源。这些来源可以被视为噪声源,如电路噪声分析中的热噪声,包括物理布局和电磁威胁。作为电磁污染的定量测量,基于不同无线设备天线发射的波的聚合来定义EMI环境温度。此外,对于PCB,基于系统组件的放置和布局来定义随机EMI辐射电阻。这种阻力可用作环境中系统PCB的干扰潜在严重程度的有效测量。该模型由特定设计和制造的混合信号测试板验证。分析模型和测量结果之间的比较显示了适度的精度,其在最具预测电磁兼容性(EMC)/ EMI验证中是可接受的。所提出的模型对于传统的PCB物理参数有效地有效。

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