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Investigation of short-circuit failure limited by dynamic-avalanche capability in 600-V punchthrough IGBTs

机译:研究600 V穿通IGBT中受动态雪崩能力限制的短路故障

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Short-circuit-failure energy of insulated gate bipolar transistors (IGBTs) is generally known to be constant, depending on the thermal capacity of the devices. However, apart from the intrinsic thermal-failure limit, a premature short-circuit failure was observed for 600-V punchthrough (PT) IGBTs at turn-off transition. The observed failure seems irrelevant to the electrical-failure mode as well as the thermal-failure mode, rather, it depends on the dynamic-breakdown voltage of the device. In this paper, with comprehensive investigations into an instant short-circuit failure, it is shown that the observed short-circuit failure of the PT IGBTs results from insufficient avalanche capability, which is initiated by dynamic-avalanche breakdown and can severely degrade the short-circuit ruggedness of the PT IGBTs independent of the duration of the short-circuit event.
机译:众所周知,绝缘栅双极型晶体管(IGBT)的短路故障能量是恒定的,具体取决于器件的热容量。但是,除了固有的热故障极限外,在关断过渡时还观察到600V穿通(PT)IGBT的过早短路故障。观察到的故障似乎与电气故障模式以及热故障模式无关,而是取决于设备的动态击穿电压。本文通过对瞬时短路故障的全面研究表明,观察到的PT IGBT的短路故障是由雪崩能力不足引起的,雪崩能力是由动态雪崩击穿引发的,可严重降低短路强度。 PT IGBT的电路坚固性与短路事件的持续时间无关。

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