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Reliability of SiGe HBTs for Power Amplifiers—Part II: Underlying Physics and Damage Modeling

机译:SiGe HBT用于功率放大器的可靠性-第二部分:基础物理和损伤建模

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摘要

This paper presents the underlying physics and modeling of aggressively biased cascode SiGe heterojunction bipolar transistor power amplifier (PA) cores under large-signal operating conditions. The damage characteristics observed during RF operation, particularly the base leakage and collector-base (CB) junction failure, are investigated in detail using dc stress methods. Base leakage was characterized across geometry, voltage, and current conditions, and a damage model is purposed based on Shockley–Read–Hall theory and the reaction–diffusion equation. This model is used to predict damage under aggressive RF operations, in order to extract the operational lifetime of SiGe PAs. The onset of CB junction failure was modeled using the current-gain collapse model, and it accurately captures the failure threshold current $I_{rm Fail}$ observed during RF stress.
机译:本文介绍了在大信号工作条件下积极偏置的共源共栅SiGe异质结双极晶体管功率放大器(PA)内核的基本物理原理和建模。使用直流应力方法详细研究了在射频工作期间观察到的损坏特性,特别是基极泄漏和集电极-基极(CB)结故障。在几何形状,电压和电流条件下表征了基础泄漏,并基于Shockley-Read-Hall理论和反应扩散方程建立了损伤模型。该模型用于预测激进的RF操作下的损坏,以提取SiGe PA的工作寿命。使用电流增益崩溃模型对CB结故障的发作进行建模,它可以准确捕获RF应力期间观察到的故障阈值电流$ I_ {rm Fail} $。

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