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Segment Delay Learning From Quantized Path Delay Measurements

机译:从量化路径延迟测量中的分段延迟学习

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Our understanding on a silicon chip is limited due to low measurement resolution or model-silicon miscorrelation including variations. This paper shows that chips are better understood by combining noisy measurement results and model information through a mathematical algorithm. Our proposed method learns segment delays in logic circuits from quantized path delay measurements using ridge regression. During the learning process, we take advantage of both nominal segment delays and the delay sensitivity with respect to variations. We also interpret the ridge regression in Bayesian context and in doing so, propose an analytic formula to set the regularization parameter of the ridge regression. For the silicon measurement environments where low measurement resolution is the dominant source of measurement noise, this formula allows us to predict post-silicon results more accurately and speed up the algorithm eliminating inefficient and inaccurate cross-validation. We also demonstrate our method in enhancing the resolution of already measured path delays. We learn segment delays from quantized path delay measurements and predict the path delays prior to the quantization. Our simulation results show that the predicted path delays are much closer to actual values than the measured values and the nominal values.
机译:由于测量分辨率低或模型硅不相关(包括变化),我们对硅芯片的理解受到限制。本文表明,通过数学算法将噪声测量结果和模型信息结合起来,可以更好地理解芯片。我们提出的方法通过使用岭回归从量化路径延迟测量中学习逻辑电路中的段延迟。在学习过程中,我们利用标称段延迟和延迟敏感性对变化的优势。我们还解释了贝叶斯上下文中的岭回归,并在此过程中提出了一个解析公式来设置岭回归的正则化参数。对于低测量分辨率是测量噪声的主要来源的硅测量环境,该公式使我们能够更准确地预测硅后结果,并加快算法,消除效率低下和不准确的交叉验证。我们还演示了提高已测路径延迟分辨率的方法。我们从量化的路径延迟测量中了解分段延迟,并在量化之前预测路径延迟。我们的仿真结果表明,预测的路径延迟比测量值和标称值更接近实际值。

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