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Iterative Diagnosis Approach for ECC-Based Memory Repair

机译:基于ECC的内存修复的迭代诊断方法

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摘要

In modern SoCs embedded memories should be protected by ECC against field failures to achieve acceptable reliability. They should also be repaired after fabrication to achieve acceptable fabrication yield, as well as during lifetime to increase lifespan. In technologies affected by high defect densities, conventional repair induces very high cost. To reduce it, in previous work we proposed the ECC-based repair scheme, consisting in using the ECC for fixing words comprising a single faulty cell, and self-repair to fix all other faulty words. This approach is of high interest for ultimate CMOS and post-CMOS technologies, where the defect densities are expected to increase significantly, and/or in very-low power designs as very-low voltage sharply increases defect densities. However, we showed recently that, for high defect densities the diagnosis circuitry required for ECC-based repair may induce large cost. In previous work we addressed this issue by means of a new family of memory test algorithms that exhibit the so-called single-read double-fault detection (SRDF) property. The SRDF algorithms resolve the diagnosis issue at no area cost. However, as they are complex and increase test length, in this paper we explore a new diagnosis approach using iterative test execution, which, together with the SRDF test algorithms, provide a set of options enabling efficient tradeoffs in terms of hardware and power costs, and test length.
机译:在现代SoC中,嵌入式记忆应受到ECC保护的,以实现可接受的可靠性。在制造后,它们也应该修复以实现可接受的制造产量,以及在寿命期间增加寿命。在受高缺陷密度影响的技术中,传统修复诱导非常高的成本。为了减少它,在以​​前的工作中,我们提出了基于ECC的维修方案,包括使用ECC来修复包括单个故障单元的单词,以及修复所有其他故障的单词。这种方法对于最终CMOS和后CMOS技术具有很高的兴趣,其中预期缺陷密度预期显着增加,并且/或在非常低的功率设计中,因为非常低的电压急剧增加缺陷密度。然而,我们最近表明,对于高缺陷密度,基于ECC的维修所需的诊断电路可能会引起大的成本。在以前的工作中,我们通过一系列新的内存测试算法撰写了这个问题,该族是所谓的单读双故障检测(SRDF)属性。 SRDF算法在没有区域成本下解决诊断问题。然而,由于它们是复杂和增加的测试长度,在本文中,我们探讨了使用迭代测试执行的新诊断方法,与SRDF测试算法一起提供一组选项,在硬件和电力成本方面提供高效权衡,和测试长度。

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