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首页> 外文期刊>Circuits and Systems I: Regular Papers, IEEE Transactions on >A Low Power Logic-Compatible Multi-Bit Memory Bit Cell Architecture With Differential Pair and Current Stop Constructs
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A Low Power Logic-Compatible Multi-Bit Memory Bit Cell Architecture With Differential Pair and Current Stop Constructs

机译:具有差分对和电流停止结构的低功耗逻辑兼容多位存储器位单元架构

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摘要

The architecture in this work uses a logic-compatible CMOS process particularly suitable for embedded applications. The differential pair construct causes the read and refresh power to be independent of any process parameter including the within-die threshold voltage. The current stop feature keeps the read voltage transition low to further minimize read power. The bit cell operates in both single bit BASE2 and multi-bit BASE4 modes. An expression for the read signal was verified with bit cell simulations. These simulations also compare the performance impact of threshold voltage variance in this architecture with a standard gain cell. A DRAM bit cell array was fabricated in the XFab 180 nm CMOS process. Measured waveforms closely match theoretical results obtained from a system simulation. The silicon retention time was measured at room temperature and is greater than 150 ms in BASE2 mode and greater than 75 ms in BASE4 mode. 180 nm, 25C analysis predicts 0.8 uW/Mbit refresh power at 630 MHz, the lowest in the literature. Further: the memory bit cell architecture presented here has a refresh power delay product several times lower than any other published architecture.
机译:本工作中的体系结构使用了特别适合嵌入式应用的逻辑兼容CMOS工艺。差分对构造使读取和刷新功率独立于任何工艺参数,包括管芯内阈值电压。电流停止功能可将读取电压转换保持在较低水平,以进一步最小化读取功率。该位单元以单位BASE2模式和多位BASE4模式工作。通过位单元仿真验证了读取信号的表达式。这些仿真还比较了此架构中标准电压单元对阈值电压变化的性能影响。 DRAM位单元阵列是通过XFab 180 nm CMOS工艺制造的。测得的波形与系统仿真得到的理论结果非常吻合。硅保留时间是在室温下测量的,在BASE2模式下大于150 ms,在BASE4模式下大于75 ms。 180 nm,25C分析预测在630 MHz频率下刷新功率为0.8 uW / Mbit,是文献中最低的。此外:此处介绍的存储位单元架构的刷新功率延迟乘积比任何其他已发布架构低数倍。

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