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Topology Design Optimization of Dielectric Substrates for Bandwidth Improvement of a Patch Antenna

机译:贴片天线带宽改善的介电基片拓扑设计优化

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Most literature studies dealing with design optimization for RF applications focused to a large extend on size and shape optimization. So far, material and topology optimization has not been pursued primarily due to the challenges associated with the fabrication of inhomogeneous materials and the limited access to analysis tools. In this paper, we focus on optimum topology/material design of dielectric substrates for bandwidth enhancement of a simple patch antenna. First, the possibility of designing arbitrary dielectric constant materials using off-the-shelf dielectrics is presented as is necessary for the practical fabrication of inhomogeneous substrates. Then, a formal design optimization procedure is conducted using the solid isotropic material with penalization (SIMP) method by relying on a fast full wave finite element-boundary integral (FE-BI) simulator. The SIMP method is a mathematically well-posed topology optimization algorithm because a continuous density function is used to relate the cell variable to the actual material properties. This also allows for a formulation in a versatile optimization framework. sequential linear programming (SLP) is used to solve the nonlinear optimization procedure with the sensitivity analysis based on the adjoint variable method. An important advantage of the proposed design optimization approach is its generality to handle multiple objectives and multidisciplinary problems. Using the proposed automated design procedure, inhomogeneous substrates are designed which allow for 250% bandwidth enhancement of the square patch antenna. Typically, only a few iterations are needed to reach convergence. Finally, the designed substrate is post-processed with image processing and fabricated using thermoplastic green machining.
机译:大多数有关RF应用设计优化的文献研究都集中在尺寸和形状优化方面。到目前为止,主要由于与非均质材料的制造相关的挑战以及对分析工具的访问受限,因此尚未进行材料和拓扑优化。在本文中,我们专注于电介质基板的最佳拓扑/材料设计,以提高简单贴片天线的带宽。首先,提出了使用现成的电介质设计任意介电常数材料的可能性,这对于不均匀衬底的实际制造是必需的。然后,借助于快速全波有限元边界积分(FE-BI)模拟器,使用带有罚分的固体各向同性材料(SIMP)方法进行正式的设计优化程序。 SIMP方法是数学上合理的拓扑优化算法,因为使用连续密度函数将单元变量与实际材料属性相关联。这也允许在通用优化框架中制定公式。顺序线性规划(SLP)用于基于伴随变量法的灵敏度分析来求解非线性优化程序。所提出的设计优化方法的一个重要优点是它具有处理多个目标和多学科问题的通用性。使用提出的自动化设计程序,可以设计不均匀的基板,从而可以将方形贴片天线的带宽提高250%。通常,只需几次迭代即可达到收敛。最后,对设计好的基板进行图像处理后处理,并使用热塑性生坯加工进行制造。

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