Multiple-layer optical interconnections using through-wafer hollow-dielectric-waveguide vias

摘要

We investigate lossy hollow-dielectric-waveguide vias in a dense optical interconnection system as a means by which many 2-D processor layers can communicate simultaneously with minimal signal attenuation. Via-guided multiple-layer signal attenuation and design guidelines are derived for both GaAs and Si substrate materials, and are compared to those for unguided interconnections at 0.85 /spl mu/m and 1.3 /spl mu/m. We find that optical interconnections using hollow-dielectric-waveguide vias can support dense low-loss interconnections at 0.85 /spl mu/m, whereas propagation through the substrate is preferred at 1.3 /spl mu/m.