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首页> 外文期刊>IEEE Photonics Technology Letters >High-performance wafer-bonded bottom-emitting 850-nm VCSEL's on undoped GaP and sapphire substrates
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High-performance wafer-bonded bottom-emitting 850-nm VCSEL's on undoped GaP and sapphire substrates

机译:在未掺杂的GaP和蓝宝石衬底上的高性能晶片键合底部发射850 nm VCSEL

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摘要

We have demonstrated high performance wafer-bonded bottom-emitting 850-nm vertical-cavity surface-emitting lasers (VCSEL's) on transparent substrates. The free-carrier absorption of the substrate was avoided by using undoped GaP or sapphire substrates. The maximum external quantum efficiency approaches 48% while the threshold current remains as low as 550 /spl mu/A for the 6/spl times/6 /spl mu/m/sup 2/ VCSEL's bonded on GaP substrates. VCSEL's with 8.6/spl times/8.6 /spl mu/m/sup 2/ aperture bonded on sapphire substrates also exhibit threshold currents of 800 /spl mu/A and external quantum efficiencies of 33.2%. The difference in efficiency between these two devices results from the change of the refractive index of the exit medium.
机译:我们已经演示了在透明基板上的高性能晶片结合底部发射850 nm垂直腔面发射激光器(VCSEL)。通过使用未掺杂的GaP或蓝宝石衬底,避免了衬底的自由载流子吸收。最大外部量子效率接近48%,而在VCSEL粘结在GaP衬底上的6 / spl次/ 6 / spl mu / m / sup 2 /中,阈值电流保持低至550 / spl mu / A。具有8.6 / spl次/8.6/spl mu / m / sup 2 /孔径的VCSEL结合在蓝宝石衬底上,其阈值电流也为800 / spl mu / A,外部量子效率为33.2%。这两种设备之间的效率差异是由出口介质的折射率变化引起的。

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