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首页> 外文期刊>Photonics Technology Letters, IEEE >Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects
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Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects

机译:用于高带宽和高能效片上互连的光学多级信令

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The scalability of high-performance computing systems is increasingly dependent on high-bandwidth and power-efficient communication between a growing number of processing cores on- and off-chip. Recent developments in silicon photonics technology can potentially alleviate many of the challenges associated with these stringent interconnection demands. In this letter, we propose the use of an optical multilevel signaling technique for on-chip interconnects in conjunction with wavelength division multiplexing to double the aggregate communication bandwidth without increasing the number of waveguides and wavelengths used, thereby reducing scaling costs.
机译:高性能计算系统的可扩展性越来越依赖于片上和片外越来越多的处理内核之间的高带宽和高能效通信。硅光子技术的最新发展可以缓解与这些严格的互连要求相关的许多挑战。在这封信中,我们建议将光学多级信令技术与波分复用结合用于片上互连,以在不增加波导数量和所用波长的情况下将总通信带宽加倍,从而降低缩放成本。

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