Implementation of active interposer for high-speed and low-cost chip level optical interconnects

摘要

A novel optoelectronic input/output interface module termed "active interposer" and polymeric waveguide film lamination technologies have been developed for optical interconnects between large-scale integration chips. The fabricated active interposers comprise vertical cavity surface emitting lasers, metal-semiconductor-metal photodiodes, submount, and Si circuits stacked via through-hole electrodes built inside the optoelectronic devices and submounted to achieve high-speed low-crosstalk noise and high-density interconnect performances. Also, waveguide film lamination technologies developed are capable of cost reductions. This paper describes the prototype demonstration of the active interposers assembled on the waveguide film-laminated printed circuit boards. Processing and test results of the fabricated optoelectronic devices suitable for three-dimensional stacking are also addressed.