机译:高速和低成本芯片电平光学互连的活性插入器的实现
Electron. Syst. Integration Dept. ASET Tokyo Japan;
integrated optoelectronics; optical interconnections; printed circuit accessories; optical polymers; photodiodes; metal-semiconductor-metal structures; surface emitting lasers; integrated circuit interconnections; optical crosstalk; optical arrays; optical waveguides; integrated optics; optoelectronic input/output interface module; active interposer; polymeric waveguide film lamination technologies; large-scale integration chips; high-speed low-cost chip level optical interconnects; vertical cavity surface emitting lasers; metal-semiconductor-metal photodiodes; submount; Si circuits; through-hole electrodes; high-speed low-crosstalk noise; high-density interconnect performance; waveguide film lamination technologies; waveguide film-laminated printed circuit boards; three-dimensional stacking;
机译:用于高速和低成本芯片级光互连的有源中介层的实现
机译:用于高速和低成本芯片级光互连的有源中介层的实现
机译:高速和低成本芯片电平光学互连的活性插入器的实现
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机译:硅 - 有机混合(SOH)集成和光子多芯片系统:高速光学互连技术
机译:用于芯片级光互连的光电多芯片模块集成