...
机译:具有亚载铜的基于GaN的功率倒装芯片LED
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan;
III-V semiconductors; copper; flip-chip devices; gallium compounds; light emitting diodes; semiconductor device reliability; thermal conductivity; wide band gap semiconductors; Cu; GaN; copper submount; high-current injection; light emitting diode reliability; lower junction temperature; nitride-based power flip-chip LED; InGaN/GaN; LEDs; flip-chip; submount;
机译:基于GaN的功率倒装芯片LED,在Cu子安装座上具有内部ESD保护二极管
机译:通过双重粗糙化表面提高功率GaN基薄膜倒装芯片LED的性能
机译:结温及其变化对GaN基大功率倒装芯片LED性能的影响
机译:双面球形帽状图案蓝宝石衬底提高了GaN基倒装芯片LED的光提取效率
机译:基于GaN的模块化拓扑实现的高密度功率转换电子产品。
机译:凹图案蓝宝石衬底上生长的GaN基LED的晶体质量和光输出功率
机译:通过由单层纳米球产生的锥形结构增强GaN基倒装芯片发光二极管的输出功率