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III-N/Si₃N₄ Integrated Photonics Platform for Blue Wavelengths

机译:III-N /SI₃N₄蓝波长的集成光子凝固平台

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In this paper, we report a low-loss photonic integrated circuits (PICs) platform at blue wavelengths of the visible spectral regime. Silicon nitride (SiN) is a popular passive waveguide material due to its fabrication flexibility, CMOS compatibility and spectral transparency in this wavelength regime. For active devices including lasers, gallium nitride (GaN) and its alloys are considered. Several basic building blocks for the development of a complete integrated platform, including blue diode lasers, in-plane- and out-of-plane light couplers, as well as on-and off-chip coupling between these active and passive components are theoretically investigated. The proposed in-plane and out-of-plane architectures operate through edge- and vertical grating couplers (VGCs), respectively. With edge-coupling, large mode-mismatch between the GaN laser diode and SiN waveguide is alleviated through nanotapers on both the active and passive sections and the calculated peak coupling efficiency is achieved to be 74% at a wavelength of 450 nm. We also separately designed efficient VGCs for coupling light from standard, commercial, off-the-shelf fibers to the SiN chip, and edge couplers for fiber-chip coupling, exhibiting coupling efficiencies of 51% and 83%, respectively. For robust on-chip light-coupling between active and passive circuit elements, with relaxed alignment tolerances, two approaches, i.e., flip-chip based hybrid integration and evanescent coupling based heterogeneous integration are studied. Calculated maximum coupling efficiencies of 40% (-4 dB) are achieved for both the hybrid and heterogeneous schemes. The theoretical work performed is an initial step towards demonstrating complex blue PICs which could offer a comprehensive range of photonic functionalities.
机译:在本文中,我们在可见光谱制度的蓝波长下报告了一个低损耗光子集成电路(PICS)平台。氮化硅(SIN)是一种流行的被动波导材料,由于其制造柔韧性,CMOS兼容性和该波长的光谱透明度。对于包括激光器,氮化镓(GaN)及其合金的有源器件。用于开发完整的集成平台的几个基本构建块,包括蓝色二极管激光器,面内外光耦合器,以及这些主动和无源部件之间的平面外光耦合器,以及在这些主动和无源部件之间的芯片耦合的情况下进行了研究。所提出的面内和平面架构通过边缘和垂直光栅耦合器(VGC)操作。利用边缘耦合,通过主动和无源部分上的纳米涂层缓解GaN激光二极管和SIN波导之间的大型模式不匹配,并且计算出的峰值耦合效率在450nm的波长下实现为74%。我们还将高效的VGC设计用于从标准,商业,现成的纤维向SIN芯片耦合光,以及用于光纤芯片耦合的边缘耦合器,分别呈现51%和83%的耦合效率。对于主动和无源电路元件之间的稳健片上光耦合,研究了两个方法,即基于倒装芯片的混合集成和基于渐振耦合的异构集成。计算杂种和异质方案的计算值为40%(-4 dB)的最大耦合效率。所执行的理论工作是朝着展示复杂的蓝色照片的初始步骤,该逐步提供全面的光子功能范围。

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