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High-temperature stability of a polyimide film

机译:聚酰亚胺薄膜的高温稳定性

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Polyimide (PMDA-ODA) films were analyzed by mass spectroscopy to determine their high-temperature stability. Using a high-resolution instrument, the identity of the low-molecular-weight evolved gases was confirmed. With a semiquantitative technique, the effect of a vacuum pre-bake was shown to reduce outgassing appreciably during subsequent treatment at high temperature. Subjection of the films to moisture did not affect their thermal stability. Low-temperature processing (240°C vs 400°C) reduced gaseous evolution by an order of magnitude.
机译:通过质谱分析聚酰亚胺(PMDA-ODA)膜以确定其高温稳定性。使用高分辨率仪器,确认了低分子量逸出气体的身份。使用半定量技术,显示了真空预烘烤的效果在高温下的后续处理过程中可显着减少脱气。薄膜受潮不会影响其热稳定性。低温处理(240°C对400°C)将气体释放减少了一个数量级。

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