机译:板对板对接焊缝中半椭圆形裂纹的新焊趾放大倍数
School of Civil & Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639198, Singapore;
School of Civil & Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639198, Singapore;
School of Civil & Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639198, Singapore;
butt welds; finite element analysis; regression analysis; surface crack; weld toe magnification factor;
机译:双面T型对接接头和十字形X形接头中的半椭圆形裂纹的新焊趾放大倍数
机译:T型对接接头中半椭圆形裂纹的焊趾放大倍数-与现有解决方案的比较
机译:T型接头半椭圆形裂纹焊趾放大系数的预测
机译:T型接头半椭圆裂纹焊趾放大系数的工程解决方案
机译:Al 2195合金搅拌摩擦塞焊接板的斜面半椭圆表面裂纹分析。
机译:变形对接焊缝焊趾处弹性应力集中系数的参数公式
机译:半椭圆焊接脚趾裂缝焊缝寿命预测应力强度因子方程的测定。
机译:焊接过渡接头裂纹应力强度因子的有限元分析