Acoustic Microimaging Enhances Analysis of Internal Defects

摘要

Many types of high-performance integrated circuits (ICs) cost only a few dollars—but price is not any indication of their quality. To the contrary, the reliability of die attachment, wire bonding, and plastic molding has reached the level where these processes are taken for granted. Nevertheless, modern ICs are mechanically complex, and things can go wrong. X-ray inspection methods typically investigate IC-to-printed circuit board solder joints as well as some aspects of the ICs themselves. Acoustic microscopy is a complementary technique well-suited for examining internal IC packaging and bonding faults.