EVG850 Fully-Automated Temporary Bonder/Debonder

摘要

The growing need to reduce device power consumption is driving increased demand for thin and ultra-thin wafers, which require special processing techniques, including temporary bonding of wafers to a carrier substrate and debonding of wafers following back-grinding and other processing steps. The EVG850TB/DB is a fully automated temporary bonding system for high-volume processing of thin and ultra-thin device wafers.