Applied Materials Inc.

摘要

Applied Materials 'FullVision' system enables real-time control of dielectric CMP processes for the 45nm node and beyond. The FullVision system couples Applied's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI and poly CMP applications. As films become thinner, CMP becomes increasingly difficult, requiring much more precise wafer-to-wafer process control to achieve acceptable yields.