Ultra-Dense: an MCM-based 3-D digital signal processor

摘要

The DSP3 Multiprocessor Project has produced a multi-GFLOP machine that is applicable to a variety of signal processing and pattern recognition problems. A companion program, the Ultra-Dense Project, is utilizing silicon-on-silicon multichip module (MCM) technology and innovative advanced packaging and physical design to achieve a parallel three-dimensional digital signal processor based on the DSP3. The authors present an overview and outline systems architecture the micro-interconnect technology (Si-on-Si MCM), and advances in physical design and packaging technology leading to an ultra-dense project demonstration.