A High Density 250 src='/images/tex/21629.gif' alt='^{circ}{rm C}'> Junction Temperature SiC Power Module Development

摘要

A high temperature wirebond-packaged phase-leg power module was designed, developed, and tested. Details of the layout, gate drive, and cooling system designs are described. Continuous power tests confirmed that the designed high-density power module can be successfully operated with 250 °C junction temperature. The power module was further utilized in an all-SiC rectifier system that achieves a 2.78 kW/lb power density.