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Energy-Effective Sub-Threshold Interconnect Design Using High-Boosting Predrivers

机译:使用高升压预驱动器的节能亚阈值互连设计

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This paper investigates the performance of the interconnects with repeater insertion in the subthreshold region. A 3X complementary metal–oxide–semiconductor (CMOS) predriver and a 4X one are proposed to enhance the driving capability. As compared to the conventional repeater, the proposed ones have higher energy efficiency. In addition, the results of Monte Carlo analysis indicate that the propose predrivers have higher concentration under the process and temperature variation than conventional one at 0.15 V. A test chip with 3X and 4X predrivers for 10-mm on-chip bus has been fabricated in 65 nm SPRVT CMOS process. The measured results show that the 3X (4X) predrivers can achieve 5 Mb/s (1.5 Mb/s) data rate at 0.15 V with an efficiency of 35.2 fJ (32.8 fJ).
机译:本文研究了在亚阈值区域中插入中继器的互连的性能。建议使用3倍互补金属氧化物半导体(CMOS)预驱动器和4倍互补金属氧化物半导体预驱动器来增强驱动能力。与传统的中继器相比,提出的中继器具有更高的能量效率。此外,蒙特卡洛分析的结果表明,在0.15 V电压下,所建议的预驱动器在工艺和温度变化下的浓度要高于传统的预驱动器。在10mm的片上总线上制造了具有3X和4X预驱动器的测试芯片。 65 nm SPRVT CMOS工艺。测量结果表明,3X(4​​X)预驱动器在0.15 V电压下可以达到5 Mb / s(1.5 Mb / s)的数据速率,效率为35.2 fJ(32.8 fJ)。

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