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IEEE Electrical Design of Advanced Packaging and Systems Symposium

召开年：2018
召开地：Chandigarh(IN)
出版时间：-

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1.Preeminent Buffer Insertion Technique For Long Advanced On-Chip Graphene Interconnects

机译：先进的长片上石墨烯互连的卓越缓冲插入技术
- 作者：Takshashila Pathade;Urmi Shah;Yash Agrawal;Rutu Parekh
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuit interconnections;
- Delays;
- Graphene;
- Copper;
- Repeaters;
- System-on-chip;
- Semiconductor device modeling;
2.A novel on-chip mismatch measurement technique for Nyquist rate ADCs

机译：奈奎斯特速率ADC的新型片上失配测量技术
- 作者：Ankur BAL;Vikram SINGH
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Built-in self-test;
- Computer architecture;
- System-on-chip;
- Multi-stage noise shaping;
- Frequency modulation;
3.Power Delivery Network Optimization In High Speed BGA Package

机译：高速BGA封装中的供电网络优化
- 作者：Rohit Mishra;Zakir Hussain;Ramanand S Hegde
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Capacitors;
- Impedance;
- Layout;
- Signal integrity;
- Analytical models;
- Tools;
- Optimization;
4.Transient and Crosstalk Analysis of Doped and Dielectric Inserted MLGNR Interconnects

机译：掺杂和电介质插入的MLGNR互连的瞬态和串扰分析
- 作者：Haritha Yeleti;Mekala Girish Kumar;Rajeevan Chandel;Yash Agrawal
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuit interconnections;
- Crosstalk;
- Switches;
- Graphene;
- Delays;
- Dielectrics;
- Resistance;
5.Extension of EMPSIJ for Estimating the Impact of Substrate Noise on Jitter in a CMOS Inverter

机译：EMPSIJ的扩展，用于估计衬底噪声对CMOS反相器中抖动的影响
- 作者：Vijender Kumar Sharma;Jai Narayan Tripathi;Hitesh Shrimali
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Jitter;
- Substrates;
- Inverters;
- Power supplies;
- Transfer functions;
- Semiconductor device modeling;
- Transistors;
6.Crosstalk Analysis for Rough Copper Interconnects considering Ternary Logic

机译：考虑三元逻辑的粗铜互连线串扰分析
- 作者：Sunil Pathania;Somesh Kumar;Somesh Kumar
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuit interconnections;
- Crosstalk;
- Repeaters;
- Rough surfaces;
- Surface roughness;
- Delays;
- CNTFETs;
7.A Shortest Path Algorithm for 3D Integrated Circuit TSV Assignment

机译：3D集成电路TSV分配的最短路径算法
- 作者：Aman Soni;Sahil Deshmukh;Somesh Kumar
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Through-silicon vias;
- Routing;
- Three-dimensional displays;
- Bridge circuits;
- Integrated circuit interconnections;
- Heuristic algorithms;
8.Package Level Radio Frequency Interference Shielding Structure Using Via Array

机译：使用通孔阵列的封装级射频干扰屏蔽结构
- 作者：Hai Au Huynh;Yongbong Han;Hoang Van Nguyen;SoYoung Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- electromagnetic shielding;
- microstrip lines;
- radiofrequency interference;
- receiving antennas;
- Yagi antenna arrays;
9.Signal and power integrity analysis of DDR4 address bus of onboard memory module

机译：板载内存模块DDR4地址总线的信号和电源完整性分析
- 作者：Anil Kumar Pandey
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Signal integrity;
- Thermal analysis;
- Analytical models;
- Memory modules;
- Impedance;
- Integrated circuit modeling;
10.Heterogeneous SoC Integration with EMIB

机译：与EMIB的异构SoC集成
- 作者：Ram Viswanath;Arun Chandrasekhar;Sriram Srinivasan;Zhiguo Qian;Ravi Mahajan
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
11.Enhancing shielding effectiveness of EMI film using fiber type conductive structure

机译：使用纤维型导电结构提高EMI膜的屏蔽效果
- 作者：Jaeheung Ye;Hai Au Huynh;Jungje Bang;Min Park;Jaedeok Lim;Soyoung Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Electromagnetic interference;
- Powders;
- Optical fiber dispersion;
- Optical fiber networks;
- Metals;
- Contact resistance;
- Optical fiber devices;
12.A Quick Assessment of Nonlinearity in Power Delivery Networks

机译：电力输送网络中非线性的快速评估
- 作者：Vijender Kumar Sharma;Jai Narayan Tripathi;Hitesh Shrimali
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Harmonic analysis;
- Buck converters;
- Analytical models;
- Harmonic distortion;
- Mathematical model;
- Scattering parameters;
13.Preliminary Application of Deep Learning to Design Space Exploration

机译：深度学习在空间探索设计中的初步应用
- 作者：Kallol Roy;Hakki Torun Mert;Madhavan Swaminathan
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Neural networks;
- Extrapolation;
- Training;
- Data models;
- Upper bound;
- Training data;
- Space exploration;
14.Machine Learning for Fast Characterization of Magnetic Logic Devices

机译：机器学习可快速表征磁逻辑器件
- 作者：Arun Kaintura;Kyle Foss;Ivo Couckuyt;Tom Dhaene;Odysseas Zografos;Adrien Vaysset;Bart Sorée
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Adaptation models;
- Logic devices;
- Computational modeling;
- Machine learning;
- Micromagnetics;
- Performance evaluation;
- Training;
15.Analysis of electrical power in IBM POWER9 direct-attached memory subsystem

机译：IBM POWER9直接连接的内存子系统中的电源分析
- 作者：Anil Lingambudi;Michael Pardeik;Sharath Manjunath;Wiren D. Becker
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Bandwidth;
- Power measurement;
- Voltage measurement;
- Servers;
- Voltage control;
- Program processors;
- Current measurement;
16.Method to Model Input Voltage Ripple in Multi-Domain Fully Integrated Voltage Regulators

机译：多域全集成稳压器中的输入电压纹波建模方法
- 作者：Srinivasan Govindan;Dipanjan Gope;Krishna Bharath;Srikrishnan Venkataraman
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Harmonic analysis;
- Switches;
- Voltage control;
- Integrated circuit modeling;
- Inductors;
- Mathematical model;
- Matrices;
17.CLOCK PSIJ Study under different PDN choices in LPDDR3 systems

机译：LPDDR3系统中不同PDN选择下的CLOCK PSIJ研究
- 作者：Vijay Kumar Singh;Raj Kumar Nagpal;Dinesh Kumar Sharma;Luis Simoes;Eduard Kulchinsky
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Clocks;
- Jitter;
- Apertures;
- Impedance;
- Power supplies;
- Timing;
- Switches;
18.Multi-pin Optimization of Decoupling Capacitors on Practical Printed Circuit Boards

机译：实用印刷电路板上去耦电容器的多引脚优化
- 作者：Ihsan Erdin;Ram Achar
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Capacitors;
- Pins;
- Impedance;
- Optimization;
- Transmission line matrix methods;
- Genetic algorithms;
- Integrated circuits;
19.A Methodology for distributed Co-design and Coextraction of Die Re-distribution Layer and Package

机译：模具再分布层和封装的分布式协同设计和共提取方法
- 作者：Ashish Gupta;Abhishek Bhattacharya;Vansh Mohan;Ayush Singh;Ritabrata Bhattacharya;Vikas Aggarwal
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuits;
- Geometry;
- Routing;
- Tools;
- Layout;
- Metals;
- Design tools;
20.Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems

机译：抑制数字电视无线功率传输（WPT）系统的电磁干扰（EMI）的串联拓扑研究
- 作者：Mumpy Das;Seungtaek Jeong;Boogyo Sim;Seongsoo Lee;Seokwoo Hong;Youngwoo Kim;Joungho Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Topology;
- Power harmonic filters;
- Electromagnetic interference;
- Band-pass filters;
- Harmonic analysis;
- Digital TV;
- Capacitance;
21.Simulation-Based Impedance Characterization of PDN in High-Performance Multi-Chip HTCC Packages for Avionics

机译：航空电子高性能多芯片HTCC封装中PDN的基于仿真的阻抗表征
- 作者：Akash Dang;Gurvinder Singh;Shiva Prasad Jilla;Rohit Sharma;Krishan Kumar;Atanu Mukerji
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Impedance;
- Capacitance;
- Optimization;
- Reliability;
- Inductance;
- System-on-chip;
- Aerospace electronics;
22.A Study on Radiation characteristics of GSM Band Diversity Antenna using different types of Mobile Hand-set Casing

机译：不同类型手机外壳的GSM频段分集天线的辐射特性研究
- 作者：G. Shrikanth Reddy;Ankita Deo
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Antenna radiation patterns;
- Mobile antennas;
- Slot antennas;
- Microwave antennas;
- Transmitting antennas;
- Metals;
23.Wafer Quality Inspection using Memristive LSTM, ANN, DNN and HTM

机译：使用忆阻LSTM，ANN，DNN和HTM进行晶圆质量检查
- 作者：Kazybek Adam;Kamilya Smagulova;Olga Krestinskaya;Alex Pappachen James
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Computer architecture;
- Inspection;
- Training;
- Neurons;
- Neuromorphics;
- System-on-chip;
- Biological neural networks;
24.Variability-Aware Performance Assessment of Multi-Walled Carbon Nanotube Interconnects using a Predictor-Corrector Polynomial Chaos Scheme

机译：使用预测器校正多项式混沌方案的多壁碳纳米管互连的变异性性能评估
- 作者：Sakshi Bhatnagar;Amanda Merkley;Rena Berdine;Yingheng Li;Sourajeet Roy
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Predictive models;
- Integrated circuit modeling;
- Numerical models;
- SPICE;
- Carbon nanotubes;
- Integrated circuit interconnections;
- Chaos;
25.Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications

机译：用于下一代应用的高密度硅中介层封装技术的信号完整性分析
- 作者：Surender Singh;Ashish Gupta
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Silicon;
- Insertion loss;
- Scattering parameters;
- Integrated circuit interconnections;
- Routing;
- Integrated circuit modeling;
26.Modeling of Mixed CNT Bundle for Sub-threshold Interconnects

机译：亚阈值互连的混合CNT束建模
- 作者：Ashish Singh;Rohit Dhiman;Rajeevan Chandel
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuit interconnections;
- Crosstalk;
- Delays;
- Quantum capacitance;
- Resistance;
- Carbon nanotubes;
27.Efficiency of the Perturbative Stochastic Galerkin Method for Multiple Differential PCB Lines

机译：多微分PCB线路摄动随机Galerkin方法的效率
- 作者：Xinglong Wu;Flavia Grassi;Paolo Manfredi;Dries Vande Ginste
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Stochastic processes;
- Method of moments;
- Chaos;
- Mathematical model;
- Conductors;
- Transmission line matrix methods;
- Impedance;
28.A Novel Stripline Inductive Compensation Technique on High Speed IO Packages

机译：高速IO封装上的新型带状线电感补偿技术
- 作者：Kavitha Nagarajan;Aruna Bathini;Ling Li Ong;Anoop Karunan;Si Guan Lee
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Stripline;
- Impedance;
- Capacitance;
- Routing;
- Microstrip;
- Copper;
- Electromagnetic interference;
29.PDN design and sensitivity analysis using synthesized models in DDR SI/PI co-simulations

机译：使用DDR SI / PI协同仿真中的综合模型进行PDN设计和灵敏度分析
- 作者：Javid Mohamed;Tim Michalka;Selman Ozbayat;Gerardo Romo Luevano
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Solid modeling;
- Mathematical model;
- Layout;
- Biological system modeling;
- Jitter;
- Impedance;
- Correlation;
30.Phase Change Material Compact Model: Validation and Sensitivity as Thermal Interface Material

机译：相变材料紧凑模型：作为热界面材料的验证和灵敏度
- 作者：Javed Shaikh;Je-Young Chang;Weihua Tang
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Phase change materials;
- Heating systems;
- Numerical models;
- Liquids;
- Computational modeling;
- Temperature;
- Electronic packaging thermal management;
31.Design of Ultra wide band Monopole Antenna with Band rejection Capability Using Minkowski Fractal Curve

机译：利用Minkowski分形曲线设计具有频带抑制能力的超宽带单极天线。
- 作者：Balaka Biswas;Ayan Karmakar
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Ultra wideband antennas;
- Fractals;
- Slot antennas;
- Resonant frequency;
- Bandwidth;
- WiMAX;
32.LIM Algorithms for Diodes and Branch Capacitors

机译：二极管和支路电容器的LIM算法
- 作者：Jose Schutt-Ainé;Patrick Goh
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Integrated circuit modeling;
- Capacitors;
- Mathematical model;
- Transient analysis;
- Simulation;
- Network topology;
- Topology;
33.Rational Function Approximation of Parallel Coupled line Interconnects in RF Applications

机译：射频应用中平行耦合线互连的有理函数逼近
- 作者：Vrinda Karuvanchery;Nagavolu Srinivasa Murty;Dhanesh Gopinatha Kurup
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Couplings;
- Crosstalk;
- Finite element analysis;
- Integrated circuit interconnections;
- Integrated circuit modeling;
- Microstrip;
- Analytical models;
34.Power Delivery Network Design Strategy for Next Generation High Speed IO

机译：下一代高速IO的供电网络设计策略
- 作者：Mukesh Moorthy;Manjunath Jayasimha
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Jitter;
- Rails;
- Power supplies;
- Integrated circuit modeling;
- Silicon;
- Noise measurement;
- Clocks;
35.A New Compact Dual-Polarized Integrated Antenna Array for 2G/3G/4G/LTE Base Station Applications

机译：适用于2G / 3G / 4G / LTE基站应用的新型紧凑型双极化集成天线阵列
- 作者：Huashan Luan;Hong-Li Peng;Jun-Fa Mao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Antenna arrays;
- Antenna measurements;
- Dipole antennas;
- Base stations;
- Antenna radiation patterns;
- High frequency;
- Broadband antennas;
36.Impact of MWCNT Radii on the Performance of Nano Regime Interconnects

机译：MWCNT Radii对纳米结构互连性能的影响
- 作者：Amit Kumar;Brajesh Kumar Kaushik
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Propagation delay;
- Integrated circuit interconnections;
- Carbon nanotubes;
- System-on-chip;
- Ultra large scale integration;
- Copper;
37.Non-Periodic Flipped-SIR EBG for Dual-Band SSN Mitigation in 2-Layer PCB

机译：用于2层PCB中双频SSN缓解的非周期性翻转SIR EBG
- 作者：Yu-Cong Wang;Hao-Wei Chan;Hsin-Chan Hsieh;Ying-Hsi Lin;Wen-Shan Wang;Shih-Hung Wang;Ruey-Beei Wu
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Periodic structures;
- Metamaterials;
- Integrated circuit modeling;
- Dual band;
- Impedance;
- Wireless LAN;
- Resonant frequency;
38.Impact of Via Stub Position on High Speed Serial Links

机译：通孔桩位置对高速串行链路的影响
- 作者：Vijender Kumar;Mallikarjun Vasa;Sukumar Muthusamy;Gowri Anand;Sanjay Kumar;Bhyrav Mutnury
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Signal integrity;
- Electromagnetic compatibility;
- Topology;
- Resonant frequency;
- Connectors;
- Degradation;
- Insertion loss;
39.Comparison and Application of Two Approaches Extracting Equivalent Dipole Arrays of an IC from Measured Near-Field Magnitude Data

机译：两种从近场幅值数据提取集成电路等效偶极阵列的方法的比较和应用
- 作者：Kyungjin Kwak;Jingook Kim;Tae-il Bae;Kichul Hong;Hyungsoo Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Arrays;
- Data mining;
- Integrated circuit modeling;
- Magnetic field measurement;
- Magnetic fields;
- Fitting;
40.A meandered loop antenna-in-package with parasitic structure at 2.4 GHz

机译：具有2.4 GHz寄生结构的蛇形环形封装天线
- 作者：Archana Sunitha;Bhaskar Manickam
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- System-on-chip;
- Dipole antennas;
- Resonant frequency;
- Wireless communication;
- Antenna radiation patterns;
- Bandwidth;
41.Impact of Integrated Circuit Packaging on Synaptic Dynamics of Memristive Devices

机译：集成电路封装对忆阻器件突触动力学的影响
- 作者：Aidana Irmanova;Grant A. Ellis;Alex Pappachen James
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Memristors;
- Integrated circuit modeling;
- Electronics packaging;
- Resistance;
- Switches;
- Packaging;
- Semiconductor device measurement;
42.Power Supply Noise Coupling Mitigation across High Speed Serial Links

机译：跨高速串行链路的电源噪声耦合缓解
- 作者：Manjunath Jayasimha;Mukesh Moorthy
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Couplings;
- Silicon;
- Jitter;
- Impedance;
- Power supplies;
- Inductance;
- IP networks;
43.Impact of SMT Connector Pads on High Speed Serial Links

机译：SMT连接器焊盘对高速串行链路的影响
- 作者：Chang-Hsien Chen;Ching-Huei Chen;Chun-Lin Liao;Bhyrav Mutnury
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Pins;
- Signal integrity;
- Lead;
- Power cables;
- Topology;
- Insertion loss;
44.Crosstalk and EMI Reduction using enhanced Guard Trace Technique

机译：使用增强的Guard Trace技术降低串扰和EMI
- 作者：Ranjul Balakrishnan;Shanto Alex Thomas;Sujit Sharan
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Crosstalk;
- Microstrip;
- Electromagnetic interference;
- Strips;
- Substrates;
- Couplings;
- Routing;
45.Prediction of IC Equivalent Magnetic Dipoles Using Deep Convolutional Neural Network

机译：基于深度卷积神经网络的IC等效磁偶极子预测
- 作者：Hanzhi Ma;Er-Ping Li
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
46.Noise Coupling Analysis from High Voltage Capacitor Discharging Circuit in an Electronic Safety and Arming Device

机译：电子安全与装甲设备中高压电容器放电电路的噪声耦合分析
- 作者：Hyungmin Kang;Dong-Hyun Kim;Subin Kim;Seokwoo Hong;Shinyoung Park;Joungho Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Couplings;
- Trigger circuits;
- Integrated circuit modeling;
- Impedance;
- High-voltage techniques;
- Time-domain analysis;
- Low voltage;
47.Reduced graphene oxide based resistive liquid level sensor

机译：还原型氧化石墨烯电阻式液位传感器
- 作者：Vaishakh Kedambaimoole;Pavithra Belthangady;Neelotpala Kumar;Athulya Babu;Vijay Shirhatti;Suresh Nuthalapati;Mangaloremanjunatha Nayak;Narasimhaiah Subramanyam Dinesh;Konandur Rajanna
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Liquids;
- Graphene;
- Sensors;
- Physics;
- Coatings;
- Immune system;
- Instruments;
48.Contemporary On-chip System Modeling using FDTD in Low Power Regime

机译：低功耗状态下使用FDTD的当代片上系统建模
- 作者：Yash Agrawal;Rajeevan Chandel;Mekala Girish;Rutu Parekh
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
49.Modeling of Through-silicon Via (TSV) with an Embedded High-density Metal-insulator-metal (MIM) Capacitor

机译：使用嵌入式高密度金属-绝缘体-金属（MIM）电容器对硅通孔（TSV）进行建模
- 作者：Kyungjun Cho;Youngwoo Kim;Subm Kim;Gapyeol Park;Kyungjune Son;Hyunwook Park;Seongguk Kim;Sumin Choi;Dong-Hyun Kim;Joungho Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2018年
- Jitter;
- Clocks;
- Modulation;
- Signal to noise ratio;
- Sigma-delta modulation;
- System-on-chip;
- Degradation;