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Comprehensive Scaling Analysis of Current Induced Switching in Magnetic Memories Based on In-Plane and Perpendicular Anisotropies

机译:基于平面和垂直各向异性的磁存储器中电流感应开关的综合缩放分析

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Spin transfer torque based magnetic memories (STT-MRAMs) are leading contender for the replacement of SRAM caches. However, STT-MRAMs suffer from high write current, read/write stability conflicts and other failure mechanisms. In this paper, we present a comprehensive scaling analysis for STT-MRAMs based on in-plane and perpendicular anisotropy magnets in context to different failure mechanisms. Write failures are taken into consideration by the write current, read disturb failures by the critical current and read decision failure by the tunnel magneto-resistance scaling trends. Bit-cells comprising three different device structures—the conventional magnetic tunnel junctions (MTJs), the dual pillar MTJs (DP-MTJs) and the spin-orbit-torque based MTJs (SOT-MTJs) are investigated. We analyze the robustness of the aforementioned devices within the voltage constraints specified by ITRS. We also report predictive analysis results with futuristic material parameters. Through a coupled simulation framework consisting of spin transport and magnetization dynamics, we show that conventional MTJs would require higher voltages at scaled technology nodes. DP-MTJs, within ITRS voltage specifications, show better scalability (with larger bit-cell area). SOT-MTJs provide attractive power savings ( improvement) at a larger bit-cell area. Furthermore, our analysis indicates that among various possible improved material parameters, high interface perpendicular anisotropy shows the most promising way of achieving scalable memory cells at assumed ITRS voltages.
机译:基于自旋转移力矩的磁存储器(STT-MRAM)是替换SRAM缓存的主要竞争者。但是,STT-MRAM具有较高的写入电流,读取/写入稳定性冲突和其他故障机制。在本文中,我们针对不同的故障机理,针对基于面内和垂直各向异性磁体的STT-MRAM进行了全面的缩放分析。写入电流考虑了写入故障,临界电流考虑了读取干扰故障,隧道磁阻缩放趋势考虑了读取决策故障。研究了由三种不同的器件结构组成的位单元-常规的磁性隧道结(MTJ),双柱MTJ(DP-MTJ)和基于自旋轨道扭矩的MTJ(SOT-MTJ)。我们在ITRS指定的电压限制内分析了上述设备的耐用性。我们还将报告具有未来派材料参数的预测分析结果。通过由自旋输运和磁化动力学组成的耦合仿真框架,我们表明常规MTJ在按比例缩放的技术节点上将需要更高的电压。在ITRS电压规格范围内的DP-MTJ显示出更好的可扩展性(具有更大的位单元面积)。 SOT-MTJ在较大的位单元区域提供了引人注目的节能(改进)。此外,我们的分析表明,在各种可能的改善的材料参数中,高界面垂直各向异性显示了在假定的ITRS电压下实现可扩展存储单元的最有希望的方法。

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