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The Development And Optimisation Of The 01005 Component - Assembly Process

机译:01005组件-装配过程的开发和优化

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摘要

The continuing demand for smaller, lighter, portable products has driven the use of miniature components. One of the miniature component packages that is being used for resistors and capacitors is the 01005-chip component package. This component has a few different sizes ranging from .10mm (.004") × .304mm (.012") to .20mm (.008") × .40mm (.016") depending on the supplier and if the 01005 component is a resistor or a capacitor. The 01005-component package is dramatically smaller than the previous smallest component package used for resistors and capacitors, the 0201 (0.60mm or .0236" × 0.30mm or .0118") component package. The use of such a miniature component presents several significant challenges to the Surface Mount Technology (SMT) Manufacturing Process.
机译:对更小,更轻,便携式产品的持续需求推动了微型组件的使用。 01005芯片组件封装是用于电阻器和电容器的微型组件封装之一。该组件的尺寸范围从.10mm(.004“)×.304mm(.012”)到.20mm(.008“)×.40mm(.016”),取决于供应商以及01005是否为电阻器或电容器。 01005组件封装大大小于以前用于电阻和电容器的最小组件封装,0201(0.60mm或.0236“×0.30mm或.0118”)组件。这种微型组件的使用对表面贴装技术(SMT)制造过程提出了一些重大挑战。

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